Second Announcement and Call for Papers: 3DIM2003: THE 4th INTERNATIONAL CONFERENCE ON 3-D IMAGING AND MODELING October 6-10, 2003 The Banff Centre, Banff, Alberta, Canada http://www.3DIMconference.org This edition of 3DIM will include a Special Session on: HERITAGE APPLICATIONS OF 3-D IMAGING AND MODELING IMPORTANT DATES: Full paper submission: March 21, 2003 Notification of acceptance: May 14, 2003 Final paper due: June 11, 2003 SCOPE: Since 1997, the 3DIM Conference is dedicated to 3-D imaging and modeling and their applications. This field continues to strengthen its research basis in the areas of computer vision, computer graphics, and geometric modeling, but also to diversify its target applications, ranging from archaeological site modeling to advanced manufacturing. The 3DIM Conference brings together researchers from all over the world interested in a broad spectrum of issues in 3-D imaging and modeling. The Fourth Conference, held at the Banff Centre in the heart of the Canadian Rockies, will build and expand on this tradition. The 3DIM2003 Conference Committee invites you to submit original full papers in English by March 21, 2003. As in previous years, the papers will be reviewed by an international program committee. Accepted papers will be presented in single-track oral sessions and a poster session. The Conference Proceedings are published by the IEEE Computer Society Press. Further details on the paper format, electronic submission procedure and conference venue are available on the conference website: http://www.3DIMconference.org Papers are invited in the areas of: - Smart/enhanced/hand-held sensors - Sensor calibration methods - Performance assessment - Automated view planning - 3-D from multiple images and video - Geometric signal processing - Image registration and integration - Multiresolution 3-D representations - Shape and appearance modeling - Texture mapping from real images - Object recognition and classification - Surface/solid modeling from images - Reverse engineering - Dimensional inspection - Object/human/environment modeling - Manufacturing/medical applications - Heritage, art history, archaeology - Modeling for virtual reality as well as related areas. __________________________________________________________________ SPECIAL SESSION: Heritage Applications of 3-D Imaging and Modeling The 3DIM 2003 Conference will include a special half-day session devoted to the application of 3-D imaging and modeling in the areas of archaeology, art history and conservation. In recent years, several large-scale projects aimed at archaeological site modeling or museum collection digitization have emerged as a driving force for major contributions in the field. The special session will focus on the specific research issues and applications that are encountered in these areas. The Special Session Program Committee is requesting papers describing state-of-the-art contributions in 3-D reconstruction, modeling, documentation, monitoring, and visualization of cultural heritage artifacts. These contributions should clearly show how 3-D imaging supports their conservation, restoration and diffusion. __________________________________________________________________ CONFERENCE COMMITTEE: Conference chair: Marc Rioux, National Research Council of Canada Program co-chair and local arrangement chair: Pierre Boulanger, University of Alberta Program co-chair: Guy Godin, National Research Council of Canada Special session chair: J. Angelo Beraldin, National Research Council of Canada PROGRAM COMMITTEE: Heikki Ailisto, VTT Electronics (Finland) Peter Allen, Columbia University (USA) Fausto Bernardini, IBM T.J. Watson Research Center (USA) Paul Besl, PointStream (USA) François Blais, National Research Council (Canada) David Cooper, Brown University (USA) Guido-Maria Cortelazzo, University of Padua (Italy) Sabry El-Hakim, National Research Council (Canada) Frank Ferrie, McGill University (Canada) Patrick Flynn, University of Notre Dame (USA) Lorenzo Gonzo, IRST (Italy) François Goulette, Ecole des mines de Paris (France) Michael Greenspan, Queens University (Canada) Gabriele Guidi, University of Florence (Italy) Martial Hebert, Carnegie-Mellon University (USA) Patrick Hébert, Laval University (Canada) Heinz Hügli, University of Neuchâtel (Switzerland) Katsushi Ikeuchi, University of Tokyo (Japan) John Illingworth, University of Surrey (UK) Martin Jägersand, University of Alberta (Canada) Olli Jokinen, Helsinki University of Technology (Finland) Takeo Kanade, CMU/AIST (USA/Japan) Sing Bing Kang, Microsoft Research (USA) Denis Laurendeau, Laval University (Canada) Ales Leonardis, University of Ljubljana (Slovenia) Marc Levoy, Stanford University (USA) Frédéric F. Leymarie, Brown University (USA) Hans-Gerd Maas, Dresden University of Technology (Germany) Takeshi Masuda, AIST (Japan) Dinesh Pai, Rutgers University/UBC (USA/Canada) Eric Paquet, National Research Council (Canada) Marc Pollefeys, University of North Carolina (USA) Flavio Prieto, National University of Colombia (Colombia) Kathleen Robinette, Wright Patterson Air Force Base (USA) Giovanna Sansoni, University of Brescia (Italy) Francis Schmitt, Telecom Paris (France) Roberto Scopigno, ISTI-CNR (Italy) Yoshiaki Shirai, Osaka University (Japan) Chang Shu, National Research Council (Canada) Marc Soucy, InnovMetric Software (Canada) Demetri Terzopoulos, New York University (USA) Luc Van Gool, K.U.Leuven/ETH Zurich (Belgium/Switzerland) Mark Wheeler, Cyra Technologies (USA) Kazuhiko Yamamoto, Gifu University (Japan) Naokazu Yokoya, Nara Institute of Science and Tech. (Japan) SPECIAL SESSION PROGRAM COMMITTEE: Alonzo Addison, UC Berkeley (USA) Adriana Bandiera, University of Lecce (Italy) Wolfgang Böhler, Mainz U. of Applied Sciences (Germany) Marco Gaiani, Milan Polytechnical (Italy) Armin Grün, ETH Zurich (Switzerland) Takeo Ojika, Gifu University (Japan) Holly Rushmeier, IBM T.J. Watson Research Centre (USA) Robert Sablatnig, Vienna University of Technology (Austria) John Taylor, National Research Council (Canada) Virginia Valzano, University of Lecce (Italy) FOR MORE INFORMATION: http://www.3DIMconference.org mailto:3dimconf@nrc.ca