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Second International Conference
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on 3-D Imaging and Modeling
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October 4-8, 1999
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Château Laurier Hotel, Ottawa, Canada
Call for Papers
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(First
Conference Announcement
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available in PDF
Acrobat format)
3-D digital imaging and modeling is one of the fastest growing digital
technologies. Important applications such as robotics, rapid product development,
human modeling, medicine, virtual reality and scientific imaging attest
to the far reaching implications of research in this field.
A first conference, held in 1997, provided a unique forum on 3D imaging
and modeling for 150 researchers and developers from more than 15 countries.
It is in this context that the Second International Conference
on 3-D Imaging and Modeling will take place. Sponsored and organized
by the National Research Council of
Canada, and the International
Association for Pattern Recognition IAPR the conference will look at
recent advances in 3-D sensor systems, geometric data processing, geometric
modeling, and applications.
The organizing committee invites you to submit original full papers
in English by March 5, 1999. The papers will be reviewed by an international
program committee. The Conference proceedings will be available at the
time of the conference.
Topics:
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3-D sensing methods
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Smart sensors, smart scanning
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Hand-held 3-D sensors
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Integrated sensor systems
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Sensor calibration and accuracy
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Filtering; Segmentation; Edge detection
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View registration and integration
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Geometric processing algorithms
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3-D image understanding
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Surface and solid modeling
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Reverse engineering and CAD interfacing
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Texture acquisition, integration and mapping
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Object digitizing and modeling
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Human digitizing and modeling
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Site and environment digitizing and modeling
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Virtual environment modeling
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Sensor fusion
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Multiresolution 3-D representations
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Applications (industrial, medical, entertainment, etc.)
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Important Dates:
| Full paper submission deadline: |
March 15, 1999
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| Notification of acceptance: |
May 21, 1999
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| Final paper submission: |
June 11, 1999
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Paper submission:
A procedure for electronic submission is now available at the following
web site:
Conference Committee :
Program Committee:
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Heikki Ailisto, VTT Electronics (Finland)
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Ruzena Bajcsy, University of Pennsylvania (USA)
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Angelo Beraldin, National Research Council (Canada)
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Robert Bergevin, Laval University (Canada)
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Paul Besl, Alias |Wavefront (USA)
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François Blais, Vitana Corporation (Canada)
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Kevin Bowyer, University of South Florida (USA)
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Paul Cohen, École polytechnique de Montréal (Canada)
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Sabry El-Hakim, National Research Council (Canada)
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Robert Fisher, University of Edinburgh (UK)
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Patrick Flynn, Washington State University (USA)
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Dieter Fritsch, University of Stuttgart (Germany)
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Denis Gingras, National Optics Institute (Canada)
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Guy Godin, National Research Council (Canada)
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Michael Greenspan, National Research Council (Canada)
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Henrik Haggren, Helsinki University of Technology (Finland)
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Patrick Hébert, National Research Council (Canada)
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John Illingworth, University of Surrey (UK)
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Anil Jain, Michigan State University (USA)
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Peter Jones, Loughborough University (UK)
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Takeo Kanade, Carnegie Mellon University (USA)
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Takeshi Masuda, Electrotechnical Laboratory (Japan)
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Eric Paquet, National Research Council (Canada)
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Gerhard Roth, National Research Council (Canada)
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Francis Schmitt, École nationale supérieure des télécommunications
(France)
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Linda Shapiro, University of Washington (USA)
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Yoshiaki Shirai, Osaka University (Japan)
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Demetri Terzopoulos, University of Toronto (Canada)
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Michael Vannier, University of Iowa (USA)
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Kazuhiko Yamamoto, Gifu University (Japan)
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Naokazu Yokoya, Nara Institute of Science and Technology (Japan)
Conference Secretariat:
Pierre Lamoureux
Conference Manager
3DIM'99
National Research Council Canada
Montreal Road Campus, Building M-19
Ottawa, Ontario K1A 0R6
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Telephone: (613) 993-9431
Fax: (613) 993-7250
E-mail: 3dconf@nrc.ca |
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